spec no: dsah3956 rev no: v.7 date: nov/26/2008 page: 1 of 6 approved: wynec checked: allen liu drawn: y.f.lu er p: 1201002739 description the red-orange device is made with ts alingap light emitting diode. part number: aa3529ses/l hyper orange preliminary spec package dimensions notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0 .25(0.01") unless otherwise noted. 3. specifications are subject to change without notice. 4. the device has a single mounting surface. the devi ce must be mounted according to the specifications. 3.5x2.8 mm smd chip led lamp features z single color. z suitable for all smt assembly and solder process. z available on tape and reel. z ideal for backlighting. z white smd package, silicone resin. z low thermal resistance. z package: 1500pcs / reel. z moisture sensitivity level : level 2a. z rohs compliant.
spec no: dsah3956 rev no: v.7 date: nov/26/2008 page: 2 of 6 approved: wynec checked: allen liu drawn: y.f.lu er p: 1201002739 handling precautions compare to epoxy encapsulant that is hard and brittle, si licone is softer and flexible. although its characteristic significantly reduces thermal stress, it is more su sceptible to damage by external mechanical force. as a result, special handling precau tions need to be observed during asse mbly using silicone encapsulated led products. failure to comply might leads to damage and premature failure of the led. 1. handle the component along the side surfaces by using forceps or appropriate tools. 2. do not directly touch or handle the silicone lens surface. it may damage the internal circuitry. 4. the outer diameter of the smd pickup nozzle should not exceed t he size of the led to prevent air leaks. the inner diameter of the nozzle should be as large as possible. 5. a pliable material is suggested for the nozzle tip to avoid scratching or damaging the led surface during pickup. 6. the dimensions of the component must be accurately progra mmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 3. do not stack together assembled pcbs containing ex posed leds. impact may scratch the silicone lens or damage the internal circuitry.
spec no: dsah3956 rev no: v.7 date: nov/26/2008 page: 3 of 6 approved: wynec checked: allen liu drawn: y.f.lu er p: 1201002739 selection guide part no. dice lens type iv (mcd) [2] @ 150ma v iewing angle [1] min. typ. min. typ. 2 1/2 aa3529ses/l hyper orange (alingap) water clear 3800 6000 2500 4000 120 v (mlm) [2] @ 150ma notes: 1. 1/2 is the angle from optical centerline where the lumi nous intensity is 1/2 the optical centerline value. 2. luminous intensity / luminous flux: +/-15%. absolute maximum ratings at t a =25c parameter symbol value unit power dissipation p t 615 mw junction temperature [1] t j 110 c operating temperature top -40 to +85 c storage temperature ts t g -40 to +85 c dc forward current [1] i f 150 ma peak forward current [2] i fm 350 ma thermal resistance [1] (junction/ambient) r th j-a 200 c/w thermal resistance [1] (junction/solder point) r th j-s 80 c/w notes: 1.results from mounting on pc board fr4(pad size 70mm 2 ), mounted on pc board-metal core pcb is recommend for lowest thermal resistance. 2.1/10 duty cycle, 0.1ms pulse width. electrical / optical characteristics at t a =25c symbol parameter device typ. max. test conditions units peak peak wavelength hyper orange 626 nm i f =150ma d [1] dominant wavelength hyper orange 618 nm i f =150ma ? 1/2 spectral line half-width hyper orange 20 nm i f =150ma c capacitance hyper orange 25 pf v f =0v;f=1mhz v f [2] forward voltage hyper orange 3.6 4.1 v i f =150ma i r reverse current hyper orange 10 ua v r = 5v notes: 1.wavelength: +/-1nm. 2. forward voltage: +/-0.1v.
spec no: dsah3956 rev no: v.7 date: nov/26/2008 page: 4 of 6 approved: wynec checked: allen liu drawn: y.f.lu er p: 1201002739 hyper orange aa3529ses/l
spec no: dsah3956 rev no: v.7 date: nov/26/2008 page: 5 of 6 approved: wynec checked: allen liu drawn: y.f.lu er p: 1201002739 aa3529ses/l recommended soldering pattern (units : mm; tolerance: 0.1) tape specifications (units : mm) reflow soldering is recommended and the soldering profile is shown below. other soldering methods are not recommended as they might cause damage to the product.
spec no: dsah3956 rev no: v.7 date: nov/26/2008 page: 6 of 6 approved: wynec checked: allen liu drawn: y.f.lu er p: 1201002739 packing & label specifications aa3529ses/l
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